| 超声引线键合系统工艺参数优化与试验研究 |
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| 引用本文： | 冯武卫,张玉莲. 超声引线键合系统工艺参数优化与试验研究[J]. 菏泽学院学报, 2013, 0(5): 37-43 |
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| 作者姓名： | 冯武卫 张玉莲 |
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| 作者单位： | 浙江海洋学院船舶与海洋工程学院,浙江舟山316022 |
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| 基金项目： | 基金项目：浙江省科技厅重大科技专项社会发展项目（2013C13SAA10007）;浙江省教育厅科研项目（Y201328404）;浙江海洋学院科研启动项目（21185011311）;浙江海洋学院中青年教师资助项目（11182101112）;浙江海洋学院校级面上项目（21185004112） |
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| 摘 要： | 超声引线键合质量受多种键合工艺参数的影响，如键合时间、键合功率、键合压力和键合温度等，每一个参数的不合理都可能导致整个键合过程失败．通过正交实验方法设计了键合工艺参数正交试验表，利用键合强度作为键合质量指标对键合工艺参数进行了多参数优化；分析了各个工艺参数对键合质量的影响，通过进一步细化分析得到了键合参数的最优组合．优化结果实验证明了这种方法的良好效果．若应用于不同型号键合设备工艺参数的优化，只需对正交试验表进行适当调整即可．
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| 关 键 词： | 超声引线键合系统 键合 工艺参数 正交实验 参数优化 |
A Research of Process Parameters Optimum and Experimental for Ultrasonic Wire Bonding System |
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| Affiliation: | FENG Wu - wei, ZHANG Yu - lian (Ship and Ocean Engineering School, Zhejiang Ocean University, Zhoushan Zhejiang 316022, China) |
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| Abstract: | In the ultrasonic wire bonding process, there are many process parameters such as boning time, bonding power, bonding force and bonding temperature will affect the bonding quality. Any inappropriate bonding parameter settings will result to fault of whole bonding process. A new method for bonding process parameters opti- mization is researched is this paper. Firstly, an orthogonal experiment table is built and the bond strength can be considered as the bonder quality standard. Through the table, the bonding process parameters are resettled. Sec- ondly, a refined analysis is finished to obtain the best parameter settings. Lastly, a large number of experiment samples are used to verify and the good experiment result shows the useful of the optimum method. Also, this meth- od can be used to different type bonding equipment with only a few changes of the method. |
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| Keywords: | ultrasonic wire bonding system bonding process parameters orthogonal experiment parameteroptimum |
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