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UHF power amplifier design in 0.35μm SiGe BiCMOS
引用本文:宋家友.UHF power amplifier design in 0.35μm SiGe BiCMOS[J].高技术通讯(英文版),2009,15(2):147-150.
作者姓名:宋家友
作者单位:Song Jiayou(Institute of RF-& OE-ICs,Southeast University,Nanjing 210096,P.R.China;School of Information Engineering,Zhengzhou University,Zhengzhou 450052,P.R.China);Li Zhiqun,Wang Zhigon(Institute of RF-& OE-ICs,Southeast University,Nanjing 210096,P.R.China) 
基金项目:Supported by the High Technology Research and Development Programme of China (2006AA03Z418)
摘    要:A two-stage power amplifier operated at 925 MHz was designed and fabricated in Jazz' s 0.35μm SiGe BiCMOS process.It was fully integrated excluding the inductors and the output matching network. Under a single 3.3V supply voltage,the off-chip bonding test results indicated that the circuit has a small signal gain of more than 24dB,the input and output reflectance are less than- 24dB and-10dB,re- spectively,and the maximal output power is 23.5 dBm.At output power of 23.1 dBm,the PAE(power added efficiency)is...

关 键 词:BiCMOS工艺  放大器设计  高频功率  SiGe  最大输出功率  功率放大器  小信号增益  匹配网络

UHF power amplifier design in 0.35μm SiGe BiCMOS
Song Jiayou,Li Zhiqun,Wang Zhigon.UHF power amplifier design in 0.35μm SiGe BiCMOS[J].High Technology Letters,2009,15(2):147-150.
Authors:Song Jiayou  Li Zhiqun  Wang Zhigon
Institution:1. Institute of RF-& OE-ICs,Southeast University,Nanjing 210096,P.R.China;School of Information Engineering,Zhengzhou University,Zhengzhou 450052,P.R.China
2. Institute of RF-& OE-ICs,Southeast University,Nanjing 210096,P.R.China
Abstract:A two-stage power amplifier operated at 925 MHz was designed and fabricated in Jazz's 0.35μm SiGe BiCMOS process. It was fully integrated excluding the inductors and the output matching network. Under a single 3.3V supply voltage, the off-chip bonding test results indicated that the circuit has a small signal gain of more than 24dB, the input and output reflectance are less than -24dB and -10dB, respectively, and the maximal output power is 23.5 dBm. At output power of 23.1 dBm, the PAE (power added efficiency) is 30.2%, the IMD2 and IMD3 are less than -32 dBc and -46 dBc, respectively. The chip size is 1.27mm×0.9mm.
Keywords:power amplifier  SiGe  BiCMOS  heterojunction bipolar transistor
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