| 光纤通讯器件专用光敏封装胶的研制 |
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| 引用本文： | 郑永军. 光纤通讯器件专用光敏封装胶的研制[J]. 曲阜师范大学学报, 2004, 30(4): 75-78 |
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| 作者姓名： | 郑永军 |
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| 作者单位： | 曲阜师范大学化学科学学院,273165,山东省曲阜市 |
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| 摘 要： | 介绍了一种光敏封装胶的制备方法、性能及应用情况．试验表明,该胶具有光学性能优良,粘接强度高,固化定位速度快,低收缩率,耐高低温变性好等优点．可用于光纤通讯器件的粘接封装。
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| 关 键 词： | 光敏胶 封装 紫外光固化 光纤通讯器件 |
| 文章编号： | 1001-5337(2004)04-0075-04 |
STUDY ON PHOTOSENSITIVE PACKAGING ADHESIVE APPLIED IN PHOTOCONDUCTIVE FIBER COMMUNICATION APPARATUS |
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| ZHENG Yong-jun. STUDY ON PHOTOSENSITIVE PACKAGING ADHESIVE APPLIED IN PHOTOCONDUCTIVE FIBER COMMUNICATION APPARATUS[J]. Journal of Qufu Normal University(Natural Science), 2004, 30(4): 75-78 |
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| Authors: | ZHENG Yong-jun |
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| Abstract: | The author introduced the properties of photosensitive packaging adhesive. The adhesive is characterized with such good qualities as good optical performance, hige adhension, rapid photocuring, and low volume shrinkage ratio. It can also bond and package many kinds of photoconductive fiber communication apparatus. |
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| Keywords: | photosensitive adhesive packaging UV photocuring photoconductive fiber communication apparatus |
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