咪唑化合物在金属铜上形成表面膜的可焊性研究

采用上锡率法研究了咪唑化合物在铜表面所成保护膜的可焊性,并探讨了咪唑化合物类型、膜厚、再流焊次数及高温热冲击对该膜可焊性的影响。结果表明,不同类型的咪唑化合物可焊性存在明显差异,可焊性有一最优的厚度。咪唑化合物保护膜的可焊性在经多次再流焊或高温热冲击后有所下降。但双苯基苯并咪唑化合物仍能保持良好的可焊性。

Research into solderability of the film formed on copper surface with benzimidazoles

The solderability of benzimidazole films on the surface of copper is investigated by solder float test. Several factors which influence solderability of the films are discussed. These factors include type of benzimidazole, thickness of film, times of reflow welding, thermal impact, and assistant. The results show that different imidazole has different solderability and that there is an optimal thickness giving the best solderability. After several times of heat treatment, the solderability of most imidazole films on copper will decline, while bi phenyl benzimidazole maintains good solderability.