基于模拟退火的三维集成电路水冷散热网络优化算法

三维集成电路(3D-IC)通过在垂直方向堆叠多层芯片有效提高了芯片的性能和集成度.然而,过高的功率密度和温度成为3D-IC集成度提高的最大障碍.水冷散热技术将冷却液注入两层芯片间的沟道有效解决了3D-IC的散热问题,同时也带来了过高温度梯度的问题以及对散热功耗,芯片可靠性的要求.本文提出一种在有硅穿孔限制下的基于模拟退火的沟道网络优化算法,算法基于温度仿真,对散热沟道进行放置与填充操作,设计出的沟道网络可以有效降低散热功率和温度梯度.实验中,与传统的均匀直沟道的设计方法相比,我们的方法可以在相同最高温和温度梯度限制条件下,降低散热功率达67.0%.

Simulated Annealing Based 3D-IC Liquid Cooling Network Optimization Algorithm

Three-dimensional integrated circuits(3D-IC) improves the performance and integration of integrated circuits effectively.But the severe thermal problem becomes the bottleneck of its development.Interlayer liquid cooling network has been proposed as an effective cooling mechanism for heat dissipation in 3D-IC.New problems such as over-cooling and high temperature gradient emerge.In this paper,a simulated-annealing based cooling network optimization algorithm is proposed under the TSV constraint.The overall cooling network optimization is an iterative process of attempting to fill and place liquid channel cells based on simulation.Numerical results show that,under the same thermal constraints,optimized liquid cooling network can save up to 67.0％ cooling energy in comparison with straight micro-channel network.