多芯片双面PCB的热应力分析

运用隔热材料和复合材料的计算公式,采用三维有限元方法,计算了单芯片组和多芯片组集成电路板的温度场和热应力场。数值模拟结果显示,芯片组与印刷电路板之间存在较大的剪应力,这可能是芯片剥离的原因之一。芯片位置对电路板的温度场和热应力场分布影响很大。合理地布置各芯片,可有效降低电路板的温度极值和应力极值。

Thermal Stress Analysis of Double-sided PCB with Multiple Chips

The temperature fields and thermal stress fields of the integrate circuit boards with single chip and multiple chips are simulated using formula for thermic insulants and composite materials by 3D FEM(finite element method).The numerical results indicate that there are great tangential thermal stresses between chips and integration circuit boards,which may do peeled damage to the boards.Different layouts of chips on board are also investigated,which makes an impact on temperature fields and thermal stress f...