Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint |
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| Authors: | TAI Feng & GUO Fu College of Materials Science Engineering Beijing University of Technology Beijing China |
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| Affiliation: | TAI Feng & GUO Fu College of Materials Science , Engineering,Beijing University of Technology,Beijing 100124,China |
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| Abstract: | Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints.In this current research,Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder,and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size.A quantitative formula was se... |
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| Keywords: | composite solder size effect mechanical property fracture mechanism |
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