| 无铅焊接技术对印制电路板可靠性的影响 |
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| 引用本文： | 李小侠,朱荣林.无铅焊接技术对印制电路板可靠性的影响[J].上海交通大学学报,2007(Z2). |
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| 作者姓名： | 李小侠 朱荣林 |
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| 作者单位： | 上海航天局813所 上海200086 |
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| 摘 要： | 阐述了无铅焊接中焊料及其工艺特点,并与有铅焊接进行了比较.分别通过SMT再流焊接和手工焊接陈述了无铅焊接技术在军品上的应用,论述了无铅(混合)焊接对PCB可靠性的影响.
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| 关 键 词： | 印制电路板 无铅 焊接 可靠性 |
Effect of Lead-Free Soldering Technology on the Reliability of PCB |
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| LI Xiao-xia,ZHU Rong-lin.Effect of Lead-Free Soldering Technology on the Reliability of PCB[J].Journal of Shanghai Jiaotong University,2007(Z2). |
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| Authors: | LI Xiao-xia ZHU Rong-lin |
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| Abstract: | The characteristic of lead free solder and soldering process was expounded,and compared with traditional Pb-contained soldering.The application of lead-free soldering in military equipment was stated by SMT and ironing soldering.Lastly,the effect of lead-free soldering on the reliability of PCB was discussed. |
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| Keywords: | printed circuit board(PCB) lead free soldering reliability |
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