基于X射线的电容三维可视化检测

随着电子元件封装技术的发展,电子元器件集成度越来越高,对内部缺陷的检测需求也逐渐增加,而传统方法很难实现内部缺陷的检测。三维可视化技术是利用基于X光的连续断层图像进行三维立体显示的过程,可直观显示元器件表面及其内部一定深度的结构,有助于电子元件封装过程中内部缺陷的检测。文中以常见的电容元件为对象,研究了基于断层边界轮廓线的重建算法。首先对图像进行预处理得到断层图像轮廓线,然后利用最小二乘B样条拟合形成光滑的闭合轮廓线,最后将各层轮廓线堆叠形成电容的三维模型。实验结果表明算法能显示出元器件表面及内部结构,可用来检测元器件的内部缺陷,协助评估元器件质量。

3D Visual Detection of the Capacitance Based on X-ray

With the development of electronic packaging technology, the integration of electronic components is gradually increasing. It is difficult for traditional methods to detect internal defects of electronic packaging components. 3D visualization technology is the process of 3D display using continuous tomography images based on X-ray, and it can display the surface and the internal structure of certain depth of the component visually, which can be helpful to detect internal defects in electronic packaging process. Common capacitive is the object in this paper, and a reconstruction algorithm based on fault boundary contours is discussed here. First, fault boundary contours can be obtained after pre-processing, then they can be formed into smooth closed contours after fitting by the least squares B-spline fitting, which finally can be stacked to form 3D model of the capacitive. Experimental results demonstrated that the algorithm can display the surface and the internal structure of the component, and it can detect internal defect, which is helpful to evaluate the quality of the component.