Ni,Si,Mn和Ti对高强度铜合金力学性能和导电性能的影响

利用合金化方法，并借助金相、SEM等测试分析手段研究了Ni／Si，Mn／NiSi和Ti对纯铜显微组织、力学性能和导电性能的影响．结果表明，Ti，Ni和Si均有提高合金组织稳定性的作用，但Mn，Ni和Si的加入不能有效地阻碍合金组织在高温下的长大．Ti，Ni和Si的加入还大幅度提高了合金强度．含w(Ni)=6％和w(Si)=1．42％的铜合金的抗拉强度达到了907MPa，同时，合金的导电性也保持在较高水平，达到了强度和导电性的良好匹配．然而：Mn，Ni和si的加入没有明显的强化作用．反而使导电性大幅降低。

Effect of Ni, Mn, Si and Ti on mechanical and electronic properties of copper alloy

Microstructure, mechanical properties and electrical conductivity of copper based alloys with additions of Ni/Si, Mn/NiSi, and Ti have been investigated by optical microscope and scanning electron microscope. It is found that the microstructure stability of the alloys increases when Ti, Ni and Si is added, while the addition of Mn,Ni and Si can not restrict the growth of the matrix grains at elevated temperatures. The strength of alloy increases remarkably with Ti, Ni and Si additions and it reaches 907 MPa when 6%Ni and 1 42%Si are added. The electrical conductivity of the alloy deceases with the Ni/Si addition but it still remains at a high level. Additions of Mn,Ni and Si do not result in increase of strength, meanwhile the electrical conductivity decreases significantly.