基于DM60红外热像仪的电路板卡温度测量分析

电路板红外测温是热像仪应用领域的一个重要方面，但由于测温过程中影响因素比较复杂，至今没能得到深入应用。文章对电路板红外测温影响因素进行了理论推导，指出在一般的电路板红外测温中，环境温度和辐射率是影响测温准确性的主要因素，并对这两个因素进行了具体详细的分析。通过DM60热像仪测得的试验数据对分析结果进行验证，利用matlab 对实验数据进行拟合，直观表现出环境温度和辐射率的影响规律，为电路板红外测温的校正提供依据。

Temperature measurement analysis of circuit boards based on DM60 infrared thermography

The board infrared temperature measurement is an important aspect of the Infrared thermography applications, but it has failed to get in-depth applications due to the complexity of the influencing factors in the temperature measurement process. Article gives the theoretical derivation of the influencing factors of the infrared temperature measurement of the circuit board, indicate that the environmental temperature and radiation rate is the main factor affecting the temperature measurement accuracy in the general board of infrared temperature measurement, and analysis the two factors specifically. Verify the results of the analysis using experimental data. The experimental data were fitted to visually demonstrate the impact of environmental temperature and radiation rate through matlab, provide the basis for the calibration of infrared temperature measurement of the circuit board.