| Ag-Cu、Ag-H_(62)复合电接点材料界面的原子扩散行为 |
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| 引用本文： | 周文彧,夏守余,陈家骏.Ag-Cu、Ag-H_(62)复合电接点材料界面的原子扩散行为[J].北京科技大学学报,1988(3). |
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| 作者姓名： | 周文彧 夏守余 陈家骏 |
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| 作者单位： | 北京钢铁学院
(周文彧，夏守余)，北京电工材料厂(陈家骏) |
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| 摘 要： | 用扫描电镜能谱分析半定量和定量测定,经不同热处理工艺的Ag-Cu、Ag-H_(62)冷复合和磁控溅射复合电接点材料界面的成分分布,计算了扩散系数激活能实验表明,材料复合界面是金属键结合。
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| 关 键 词： | 活化能 冷压 扩散系数 溅射 冷复合 磁控溅射 |
Interface Atomic Diffusion of the Ag-Cu and Ag-H_(62) Electric Contact Materials |
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| Zhou Wengyu,Shia Souyu,Cheng Jiajun.Interface Atomic Diffusion of the Ag-Cu and Ag-H_(62) Electric Contact Materials[J].Journal of University of Science and Technology Beijing,1988(3). |
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| Authors: | Zhou Wengyu Shia Souyu Cheng Jiajun |
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| Abstract: | After the Ag-Cu and Ag-H62 electric contact materials arc made by cold press-rolling (or sputtering in magnetic field) and annealed, the quantitative and semi-quantitative analysis are carred out by scanning electron microscope. The results show that the interfaces are of metallic bonding. The diffusion coefficients and the activation energies are also calculated. |
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| Keywords: | activation energy cold press diffusion coefficient sputtering cold press rolling sputtering in magnetic field |
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