| Progress in material removal mechanisms of surface polishing with ultra precision |
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| 作者姓名： | XUJin LUOJianbin LUXinchun ZHANGChaohui PANGuoshun |
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| 作者单位： | [ogy,TsinghuaUniversity,Beijing100084,China |
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| 摘 要： | Chemical mechanical polishing (CMP) process is commonly regarded as the best method for achieving global planarization in the field of surface finishing with ultra-precision. The development of investigation on material removal mechanisms for different materials used in computer hard disk and ultra-large scale integration fabrication are reviewed here. The mechanisms underlying the interaction between the abrasive particles and polished surfaces during CMP are addressed, and some ways to investigate the polishing mechanisms are presented.
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| 关 键 词： | 化学机械抛光 CMP 物质迁移机理 磨损 ULSL 计算机硬盘 |
| 收稿时间： | 2004-02-23 |
| 修稿时间： | 2004-06-28 |
Progress in material removal mechanisms of surface polishing with ultra precision |
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| XUJin LUOJianbin LUXinchun ZHANGChaohui PANGuoshun.Progress in material removal mechanisms of surface polishing with ultra precision[J].Chinese Science Bulletin,2004,49(16):1687-1693. |
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| Authors: | Email author" target="_blank">Jin?XuEmail author Jianbin?Luo Xinchun?Lu Chaohui?Zhang Guoshun?Pan |
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| Institution: | XU Jin, LUO Jianbin, LU Xinchun, ZHANG Chaohui & PAN Guoshun State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China |
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| Abstract: | Chemical mechanical polishing (CMP) process is commonly regarded as the best method for achieving global planarization in the field of surface finishing with ultra-precision. The development of investigation on material removal mechanisms for different materials used in com-puter hard disk and ultra-large scale integration fabrication are reviewed here. The mechanisms underlying the interac-tion between the abrasive particles and polished surfaces during CMP are addressed, and some ways to investigate the polishing mechanisms are presented. |
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| Keywords: | CMP material removal mechanism wear ULSI com-puter hard disk |
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