| 化学置换镀铜 |
| |
| 引用本文： | 丁素芳,牛家治. 化学置换镀铜[J]. 淮北煤炭师范学院学报(自然科学版), 1995, 0(3) |
| |
| 作者姓名： | 丁素芳 牛家治 |
| |
| 作者单位： | 淮北煤师院化学系(丁素芳)，淮北煤师院化学系(牛家治) |
| |
| 摘 要： | 本文介绍了置换镀铜的原理和方法,并探讨了除锈工艺、镀液浓度、温度、添加剂等诸多因素对镀层质量的影响。
|
| 关 键 词： | 置换镀 硫酸铜 硫脲 |
Chemical Displacement Plating Copper |
| |
| DingSufang NiuJiazhi. Chemical Displacement Plating Copper[J]. Journal of Huaibei Coal Industry Teachers College(Natural Science edition), 1995, 0(3) |
| |
| Authors: | DingSufang NiuJiazhi |
| |
| Affiliation: | Department of Chemistry |
| |
| Abstract: | This paper repitred a piece of principle and method on displacement plating copper .It studied the mtereference of plating quality (technoloyy on griding iron, concdrtion of plating soulution. temperature and additives ect) |
| |
| Keywords: | displacement olating cupric sulfate thiourea |
| 本文献已被 CNKI 等数据库收录！ |
