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Ni-P-B4C复合电刷镀工艺研究
引用本文:匡建新,汪新衡. Ni-P-B4C复合电刷镀工艺研究[J]. 湖南文理学院学报(自然科学版), 2001, 13(2): 58-61
作者姓名:匡建新  汪新衡
作者单位:湖南大学衡阳分校机械系;湖南大学衡阳分校机械系
摘    要:在Ni-P-B4C合金电刷镀技术的基础上,研究了在镀液中加入B4C微粒,通过改变镀液浓度、电压、pH值以及镀速等条件,达到改变镀层的厚度、硬度以及耐蚀性等。经过多次实验比较,得到了Ni-P-B4C合金复合电刷镀镀液较佳的浓度配制。并对电刷镀镀液各成分在刷镀中的作用以及它们对镀速和镀层成分的影响等方面作了较详细的分析。进而对复合电刷镀中微粒的共沉积机理作了初步的探讨。从而提出了一套较完整的Ni-P-B4C复合电刷镀工艺方案。

关 键 词:复合电刷镀  镀液浓度  Ni-P-B4C复合镀层
文章编号:1009-3818(2001)02-0058-04
修稿时间:2000-11-23

STUDY ON COMPOUND ELECTRO-BRUSH PLATE Ni-P-B4C
KUANG Jian-xin WANG Xin-heng. STUDY ON COMPOUND ELECTRO-BRUSH PLATE Ni-P-B4C[J]. Journal of Hunan University of Arts and Science:Natural Science Edition, 2001, 13(2): 58-61
Authors:KUANG Jian-xin WANG Xin-heng
Abstract:The influence of plate liquid consisteny,voltage,the pH value and plating speed on film thickness,hardness and corrosion-resisting were studied by adding B 4C particle into Ni-P alloy electro-brush plate liquid.The effect of electro-brush plate liquid composition on plating speed and film composition was analysed in detail.At the same time,the deposit mechanism of compound electro-brush plate was discussed.A more complete Ni-P-B 4C comound electro-brush plate technology plan was obtained.
Keywords:compound electro-brush plate  electro-brush plate  Ni-P-B 4C compound film
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