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高速集成电路三维互连结构电容参数的多重网格法提取
引用本文:郑戟,李征帆.高速集成电路三维互连结构电容参数的多重网格法提取[J].上海交通大学学报,1998,32(4):85-88.
作者姓名:郑戟  李征帆
作者单位:上海交通大学电子工程系
摘    要:提出用多重网格矩量法计算高速集成电路中的三维互连结构的电容参数,用以提高三维互连结构参数提取时求解大型稠密满秩线性代数方程组的效率.给出了在均匀介质中正方体导体和双导体互连线的十字形交越的电容参数,计算结果与FASTCAP软件所得到的一致.

关 键 词:高速集成电路  三维互连结构  矩量法  多重网格方法

Capacitance Extraction of Three Dimensional Interconnects in High Speed Integrated Circuit by Multi Grid Method
Zheng Ji,Li Zhengfan.Capacitance Extraction of Three Dimensional Interconnects in High Speed Integrated Circuit by Multi Grid Method[J].Journal of Shanghai Jiaotong University,1998,32(4):85-88.
Authors:Zheng Ji  Li Zhengfan
Institution:Zheng Ji,Li Zhengfan Department of Electronic Engineering,Shanghai Jiaotong University,China
Abstract:The multi grid moment method is presented to compute the capacitance parameter of the three dimensional interconnects in high speed integrated circuit. The computational efficiency for the large dense full rank linear equations involved in the capacitance extraction is improved by multi grid segmentation scheme. The computational examples are given for cubical conductor and two bus cross over interconnects. The results are in good agreements with that of the FASTCAP software developed by MIT.
Keywords:high speed integrated circuit  3D interconnects  moment method  multi  grid method
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