| 红外热成像及全息照相技术对胶接箱体热特性的研究 |
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| 引用本文： | 王裕文,谭玉山,顾崇衔.红外热成像及全息照相技术对胶接箱体热特性的研究[J].西安交通大学学报,1988(5). |
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| 作者姓名： | 王裕文 谭玉山 顾崇衔 |
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| 作者单位： | 西安交通大学机械工程系
(王裕文，谭玉山)，西安交通大学机械工程系(顾崇衔) |
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| 摘 要： | 本研究室设计中造了一台胶接结构车床模拟主轴箱体,应用红外热成像技术测试了其实时温度场,并应用激光全息摄影技术进行测试及计算热变形。本文提供了机床热特性测试的新技术。
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| 关 键 词： | 热特性 红外线摄影 全息照相术 粘接 |
THERMAL CHARACTERISTICS OF BONDED STRUCTURE ANALYSIS USING INFRARED THERMOGRAPHY AND HOLOGRAPHY |
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| Wang Yuwen,Tan Yushan,Gu Chongxian.THERMAL CHARACTERISTICS OF BONDED STRUCTURE ANALYSIS USING INFRARED THERMOGRAPHY AND HOLOGRAPHY[J].Journal of Xi'an Jiaotong University,1988(5). |
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| Authors: | Wang Yuwen Tan Yushan Gu Chongxian |
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| Institution: | Wang Yuwen;Tan Yushan;Gu Chongxian (C. H. Ku) (Department of Mechanical Engineering) |
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| Abstract: | In this research division, A model fabrication of a lathe spindle box wasdesigned and manufactured, which was bonded by epoxy resin. Infrared thermo-graphy was used to monitor and caloulate the real-time temperature field of theabove structure. And the holography was used to measure and calculate the ther-mal deformation. In this paper, the advanced measuring technique of thermalcharacteristics of the machine tool is presented. |
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| Keywords: | thermal characteristics infrared photography holography adhesion bond |
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