高热流密度电子设备液冷技术研究进展

电子设备的热流密度随着设备本身的小型化与高性能需求的不断提高而呈现出越来越大的趋势。较低的散热能力使得风冷技术很难应用到未来电子设备高热流密度的散热。目前电子设备散热技术的研究热点是液冷技术，主要得益于液冷具有流动性强、换热系数高等优势。本文概括介绍了可用于电子设备散热的几种液冷技术，其中重点介绍了微通道冷却、喷雾冷却、射流冷却和浸没式冷却技术，并对每种液冷技术的工作原理以及目前的研究进展进行了介绍和分析。最后探讨了未来液冷技术的发展方向，指出了液冷技术有待深化研究方向上存在的问题，提出了进一步深入研究液冷技术的详细建议。

Research Progress of High Heat Flux Electronic Devices Heat Transfer Technology

Continued miniaturization and demand for high-end performance of electronic devices have led to dramatic increase in their heat flux generation. Consequently, air cooling technology is increasingly falling short in meeting the ever-increasing cooling needs for electronic devices. Liquid cooling has the advantages of strong fluidity and high heat transfer coefficient, these make it to the first choice for modern electronic equipment cooling systems. In this paper, several liquid cooling technologies used for cooling electronic equipment, especially microchannel, spray, jet impingement and immersion cooling, are summarized. This paper also briefly introduced and analyzed the basic heat dissipation principle and research status of every cooling technology. Finally, this paper discusses the future development direction of liquid cooling technology, points out the problems that need to be deepened in the research direction of liquid cooling technology, and puts forward detailed suggestions for further research on liquid cooling technology.