| 印制电路板免清洗技术研究 |
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| 引用本文： | 连晋和. 印制电路板免清洗技术研究[J]. 科学之友, 2009, 0(3): 14-15 |
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| 作者姓名： | 连晋和 |
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| 作者单位： | 山西省电子高级技工学校; |
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| 摘 要： | 文章针对传统焊接工艺中由于助焊剂对环境的污染,旧的焊接工艺将被淘汰,免清洗技术中使用了低固态含量的助焊剂,可以免于清洗,工艺先进,符合环保要求。
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| 关 键 词： | 焊接工艺 助焊剂 环保 免清洗技术 |
Study on No-clean Technology Printed Circuit Board |
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| Lian Jinhe. Study on No-clean Technology Printed Circuit Board[J]. Friend of Science Amateurs, 2009, 0(3): 14-15 |
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| Authors: | Lian Jinhe |
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| Abstract: | Because the flux in the traditional welding process pollutes environment, the old welding technology will be phased out. Flux with low-solid content is used in no-clean technology, which is advanced and can meet the requirements of environmental protection. |
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| Keywords: | welding technology flux environmental protection no- clean technology |
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