Cu-Ni-P合金镀层的制备及性能

在柠檬酸盐溶液中电沉积制备了Cu-Ni-P合金镀层.采用能谱(EDS)、X射线衍射(XRD)、扫描电镜(SEM)对合金的成分、结构、形貌进行了分析.用交流阻抗(EIS)和动电位极化曲线法研究了镀层的腐蚀性能.结果表明,电沉积方法制备的Cu-Ni-P合金镀层具有纳米晶结构,镀层表面平整、光亮.P的加入使Cu-Ni合金镀层的硬度和耐腐蚀性能得到提高.

Preparation and Properties of Cu-Ni-P Alloy Deposits

The Cu-Ni-P alloy deposits were prepared by electrodeposition.Their composition,structural and morphology were characterized using X-ray diffraction(XRD),energy dispersive spectrum(EDS) and scanning electron microscopy(SEM).The corrosion behaviors of the deposits were evaluated by polarization curve and electrochemical impedance spectroscopy(EIS).The results reveal that a coherent,compact and bright Cu-Ni-P alloy deposit can be prepared by electrodeposition from sulphate/citrate solution.The structure of the Cu-Ni-P alloy deposit is a single f.c.c-phase nano crystalline.The corrosion resistance can be improved significantly through codepositing element P into Cu-Ni alloy.