| N-甲基硫脲对硫酸盐镀铜的影响 |
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| 引用本文： | 林航,余小宝,李巧云,刘深娜,杨阳,林珩,陈国良.N-甲基硫脲对硫酸盐镀铜的影响[J].漳州师院学报,2013(1):82-86. |
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| 作者姓名： | 林航 余小宝 李巧云 刘深娜 杨阳 林珩 陈国良 |
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| 作者单位： | 漳州师范学院化学与环境科学系,福建漳州363000 |
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| 基金项目： | 福建省科技厅高校产学研重大项目（2010H6029）;福建省教育厅科技项目（JA10208） |
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| 摘 要： | 采用电化学循环伏安法（CV）和电化学石英晶体微天平（EQCM）方法研究了添加剂N-甲基硫腮（MTU）对铜阳极溶出和阴极沉积过程的影响：通过塔菲尔方程研究了N-甲基硫脲和Cl-共同存在时对镀层耐腐蚀性的影响．结果表明：N-甲基硫脲改变了其反应历程，生成Cu（I）的中间产物：当Cl-浓度70mg／L时，铰层的耐腐蚀性最好．
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| 关 键 词： | 酸性镀铜 N-甲基硫脲 塔菲尔曲线 EQCM 铜 |
Effects of N-Methylthiourea on Sulfate Copper Electroplating |
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| LIN Hang,YU Xiao-bao,LIU Shen-na,YANG Yang,LIN Heng,CHEN Guo-liang.Effects of N-Methylthiourea on Sulfate Copper Electroplating[J].Journal of ZhangZhou Teachers College(Philosophy & Social Sciences),2013(1):82-86. |
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| Authors: | LIN Hang YU Xiao-bao LIU Shen-na YANG Yang LIN Heng CHEN Guo-liang |
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| Institution: | (Department of Chemistry and Environment Science, Zhangzhou Normal University, Zhangzhon, Fujian 363000, China) |
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| Abstract: | The influence of N-Methylthiourea （MTU）on the anodic dissolution and cathodic deposition of Cu in acid sulphate plating bath was studied by cyclic voltammetry and electrochemical quartz crystal microbalance（EQCM）. The effect of coexisted MTU and CI＂ on the corrosion resistance of copper deposition was investigated by Tafel equation. The results showed that N-Methylthiourea can change the mechanism of the anodic dissolution and cathodic deposition, produce the Cu＋ ions. When Cl- is 70mg/L, the corrosion resistance of copper deposition is the best. |
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| Keywords: | Acidic copper plating N-Methylthiourea（MTU） Tafel curve Electrochemical quartz crystal microbalance （EQCM） Copper |
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