Net-shape forming of composite packages with high thermal conductivity |
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| Authors: | HE XinBo QU XuanHui REN ShuBin & JIA ChengChang School of Materials Science Engineering State Key Laboratory for Advanced Metals&Materials University of Science Technology Beijing Beijing China |
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| Institution: | HE XinBo,QU XuanHui,REN ShuBin & JIA ChengChang School of Materials Science , Engineering,State Key Laboratory for Advanced Metals&Materials,University of Science , Technology Beijing,Beijing 100083,China |
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| Abstract: | The continuing miniaturization of electronic devices in microelectronics and semiconductors drives the development of new packaging materials with enhanced thermal conductivity to dissipate the heat generated in electronic packages.In recent years,several promising composite materials with high thermal conductivity have been developed successfully for high performance electronic equipment to replace the traditional Kovar and Cu/W or Cu/Mo alloys,such as SiCp/Al,SICp/Cu,diamond/Al and diamond/Cu.However,thes... |
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| Keywords: | composites packages net-shape forming high thermal conductivity |
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