Simulation of dynamic recrystallization for an Al-Zn-Mg-Cu alloy using cellular automaton

A cellular automata (CA) model has been developed to predict and control the microstructure evolution during hot deformation on 7085 aluminum alloy. The initial microstructure and thermal-mechanical parameters were used as the input data of the CA model. To link microstructure evolution with macroscopic flow stress, dislocation density was set as an important internal state variable. The hot deformation behavior of 7085 aluminum alloy was studied by isothermal compression tests under a deformation temperature range of 623–723 K and a strain rate range of 0.001-1s^?1 up to true strains of 0.53–1.20. Electron backscattered diffraction technique and the CA model were utilized to systematically investigate the effects of strain, strain rate and deformation temperature on the microstructure evolution, and further to predict the average grain diameter and the recrystallization fraction after deformation. The simulated results were validated by the experimental data to demonstrate the feasibility and predictability of the CA model.