| 交流阻抗测定化学镀镍的电化学机理 |
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| 引用本文： | 胡茂圃 栾本利. 交流阻抗测定化学镀镍的电化学机理[J]. 北京科技大学学报, 1991, 13(2): 162-168 |
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| 作者姓名： | 胡茂圃 栾本利 |
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| 作者单位： | 北京科技大学表面科学与腐蚀工程系(胡茂圃)，北京科技大学表面科学与腐蚀工程系(栾本利) |
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| 摘 要： |
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| 关 键 词： | 交流阻抗 化学镀 电化学机理 镀镍 |
An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements |
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| Hu Maopu Luan Benli. An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements[J]. Journal of University of Science and Technology Beijing, 1991, 13(2): 162-168 |
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| Authors: | Hu Maopu Luan Benli |
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| Affiliation: | Department of Surface Science and corrosions |
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| Abstract: | The Model 368 system was used to measure the AC impedance of the process of electroless nickel plating. One inductive loop is found at low frequencies. A theoretical model including the step of adsorption of HaPO2-ions is established based on the AC impedance measurements. |
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| Keywords: | electroless nickel plating electrochemical mechanism AC impedance measurement |
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