| 柔性LED灯丝的发展进程与展望 |
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| 引用本文： | 王江,石明明,邹军,李文博,汤雄,李超.柔性LED灯丝的发展进程与展望[J].上海应用技术学院学报,2020,20(1):40-46. |
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| 作者姓名： | 王江 石明明 邹军 李文博 汤雄 李超 |
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| 作者单位： | 上海应用技术大学 理学院, 上海 201418,上海应用技术大学 理学院, 上海 201418,上海应用技术大学 理学院, 上海 201418,浙江亿米光电科技有限公司, 浙江 嘉兴 314113,上海亮威照明科技股份有限公司, 上海 200127,杭州士兰明芯科技有限公司, 杭州 310018 |
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| 基金项目： | 国家自然科学基金(51302171)；上海市学科能力建设项目(14500503300)；上海市产学合作项目(沪XY-2013-61)资助 |
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| 摘 要： | 柔性LED灯丝是一种新型的LED光源,将多颗倒装芯片串联封装在柔性透明基板制备成可任意弯曲与拉伸的灯丝,实现360°全角度发光。解决了刚性LED灯丝吸光、可塑性差、结构复杂、制造繁琐等问题,使LED灯丝得到进一步的应用与推广,推动了LED灯丝灯的发展。综述了柔性LED灯丝在封装结构、封装材料、封装工艺、散热技术等方面研究状况,对实际研究和应用有一定的指导意义。
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| 关 键 词： | LED灯丝发展 柔性LED灯丝 封装材料 封装工艺 |
| 收稿时间： | 2019/4/8 0:00:00 |
Development Process and Prospect of Flexible LED Filament |
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| WANG Jiang,SHI Mingming,ZOU Jun,LI Wenbo,TANG Xiong and LI Chao.Development Process and Prospect of Flexible LED Filament[J].Journal of Shanghai Institute of Technology: Natural Science,2020,20(1):40-46. |
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| Authors: | WANG Jiang SHI Mingming ZOU Jun LI Wenbo TANG Xiong and LI Chao |
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| Institution: | School of Sciences, Shanghai Institute of Technology, Shanghai 201418, China,School of Sciences, Shanghai Institute of Technology, Shanghai 201418, China,School of Sciences, Shanghai Institute of Technology, Shanghai 201418, China,Zhejiang Emitting Optoelectronic Technology Co., Ltd., Jiaxing 314113, Zhejiang, China,Shanghai Lite-way Lighting Appliance Co.Ltd., Shanghai 200127, China and Hangzhou Shilan Azure Co., Ltd., Hangzhou 310018, China |
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| Abstract: | The flexible LED filament is a new type of LED light source. Arbitrary bending and stretching filament was prepared by encapsulating multiple flip chips in series in the flexible transparent substrate, so as to realize full angle illumination of 360°. The problems of rigid LED filament such as light absorption, poor plasticity, complex structure and cumbersome manufacturing were solved, which further ensured the application and popularization of LED filament, and promoted the development of the LED filament lamp. The present research status of flexible LED filament in packaging structure, packaging materials, packaging technology, heat dissipation technology was summarized, which was of certain guiding significance for the practical research and application. |
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