高密度倒装键合中多物理量协同控制机制与实现

针对超薄高密度芯片倒装键合，我们在超薄芯片的表面作用机理与高效剥离、基于飞行视觉的多自由度高精对准与高效贴片、键合界面接触电阻的建模计算及精确控制等方面取得重要进展。主要创新工作包括：（1）揭示了微薄芯片拾取过程中剥离与碎裂的竞争行为及其影响机理，发明了基于串并联混合机构的四自由度贴片装置及其力/位控制方法，实现了超薄芯片的无损拾取和多自由度高效高精贴片；（2）发明了基于多反射镜的飞行视觉定位装置，提出了多自由度调平、图像质量改善与超分辨率重建等图像处理方法，实现了高精快速定位；（3）揭示了超薄芯片倒装键合界面形成机理，发现了导电胶倒装键合中接触电阻“弯曲效应”，提出了键合压力、温度、基板张力等协同控制方法及装置；（4）研制了基于各向异性导电胶倒装热压焊工艺的高密度芯片倒装键合原型机，实现了最大芯片尺寸5 mm×5 mm、芯片间距15μm的高密度芯片封装。

Multi-physics Cooperative Control and Implementa-tion for High-Density Flip-Chip Bonding

For ultra-thin high-density flip-chip bonding , great＆amp;nbsp;achievements , including ultra-thin chips＇surface operat-ing mechanism and peeling , flying vision based precise alignment and efficient mounting , modeling , calculating and control of interface contact resistance , have been made during the research period .Major innovations in-cluded： （ 1 ） revealing a modest pickup chip peeling and chipping process and its impact on the competitive behavior of the mechanism , and inventing a series-par-allel hybrid mechanism based on four degrees of free-dom patch device and force /position control method to achieve a ultra-thin chips lossless efficient pick and multi-DOF high precision SMD; （ 2 ） inventing a flight vision method based on multi-vision mirror positioning device, proposing a multi-degree of freedom leveling , image quality improving and super-resolution recon-struction of image processing method to achieve a high-precision rapid positioning; （ 3 ） revealing a slim flip-chip bonding interface formation mechanism , discove-ring the conductive adhesive flip-chip bonding in con-tact resistance “bending effect”, put forwarding the bonding pressure , temperature , substrate tension coop-erative control method and apparatus; （ 4 ） based on ACF （ Anisotropic Conductive Film ） flip hot welding , developing a high-density flip-chip bonding apparatus prototype , based on which , the flip-chip bonding for high-density chips with maximum chip size 5mm × 5mm, pitch 15μm, is achieved.