硅臂加工误差对微靶装配精度的影响研究

为预测加工误差对微靶装配精度的影响,开展了加工误差对硅臂刚度及应力分布的影响研究. 基于PRO/E逆向工程对实际加工的硅臂样品建模,并搭建实验平台,建立微力与微位移关系的数学模型. 采用仿真与实验相结合的方法,对硅臂存在加工误差与无加工误差的情况下的刚度进行对比,定量预测微靶的装配精度. 研究表明为提高装配精度,必须充分考虑装配力和形位误差形成的非线性误差和非均匀应力场的影响. 

Research on the Microbarn Assembly Accuracy Influenced by the Machining Errors of Silicon Arm

To predict the influence of machining errors on ignition target assembly accuracy, the influence of machining errors on silicon arm's stiffness and the stress distribution was studied. Combined ANSYS with Pro/E reverse engineering, the processed sample of silicon arm was modeled and simulated. The mathematic model established the relation of micro-force to micro-displacement. Based on numeric simulation and experiment method, the stiffness and stress differences were compared on the silicon arm with machining errors and the design size, and the assembly accuracy was analyzed quantificationally. The results show that, the influence of the nonlinear errors and nonuniform stress distribution caused by the assembly force and form-position errors is significant to assembly accuracy.