多孔挤压铝扁管电子芯片热沉的热性能研究

为了探讨多孔挤压铝扁管构成的新型微小通道热沉的换热特性，建立了三维共轭传热数值模型并通过实验验证了该模型的可靠性。模拟分析了在0.03 W的泵功消耗下，不同孔道高宽比、宽度比、孔道数目对热沉传热性能的影响，并详细计算导热热阻、对流热阻和热容热阻。讨论了不同内翅片的宽度及高度对强化传热系数 PEC的影响，提出了最佳的翅片宽度。该研究为此类型热沉的设计提供了参考依据。

Thermal performance of a new kind of heat sink fabricated by flat aluminum multiport extruded tubes for electronic devices cooling

This study proposed a new kind of mini/micro channel heat sink fabricated by flat aluminum multiport extruded tubes, which was reliable for structure and simple for manufacturing process. In order to investigate the thermal characteristics of heat sinks, a three dimensional conjugated heat transfer model was developed. Meanwhile, an experiment was conducted to verify the reliability of the model, which included channel aspect ratio, channel width ratio and channel number on thermal resistance under pumping power consumption(Ω=0.03 W). In addition, the overall resistance of heat sink was divided into three parts (conduction resistance, convective resistance, and heat capacity resistance) and calculated in detail. Moreover, the effect of width and height of fins on enhancement of heat transfer factor (PEC) was discussed, and the optimized width of fins was calculated. This study provides a reference for the design of this kind of heat sink.