AS—70树脂与DDM固化反应的研究

本文研究了4,4′-二氨基二苯砜四缩水甘油基环氧树脂(AS-70树脂)与4,4′-二氨基二苯甲烷的固化反应。采用DSC法测定了固化反应热效应和反应速率,求得固化反应活化能为51.5KJ/mol;用TGA测定了浇铸体的热分解温度,表明AS-T70树脂的耐热性较好;用FT-IR跟踪固化反应过程中环氧基团特征吸收峰(906cm~(-1))的变化,求得的固化反应速率与DSC法测定的结果较吻合。

Study on the Curing Reaction of AS-70 Resin with DDM

This paper reports the investigation of the reaction of 4, 4'-tetraglycidyldi-aminodiphenyl sulfone (AS-70 resin) and 4, 4'-diaminophenyl methane(DDM).The heat effect and the rate of the curing reaction are measuteri by differentil scanning calorimetry (DSC). The activation energy for the reaction is obtained about 51.5 KJ/mol. The decomposition temperature of the cured resin is measured by thermogravimetric analysis (TGA). It is showed that the thermal stability of the cured resin is good. Change of the characteristic peak(906 cm~(-1)) of epoxy group during the process of curing reaction is measured by FT-IR spectrometer. The rate of reaction obtained by FT-IR is consistent with that by DSC.