八马来酰亚胺基苯基POSS/BT树脂固化行为

合成了八马来酰亚胺基苯基POSS(OMPS)，并对产物进行了测试表征。将OMPS与4,4′-双马来酰亚胺基二苯甲烷(BMI)/双酚A型氰酸酯(BCE)(BT树脂)进行共混，差示量热扫描仪(DSC)和傅立叶红外光谱仪(FT-IR)测试结果表明，在220℃左右，OMPS/BT树脂固化反应能充分进行；在140～220℃范围内分段固化，动态粘弹分析仪(DMA)测试结果显示固化后树脂的T_g不高，250℃下固化1h后，DMA测试结果显示T_g有明显提高。OMPS/BT树脂复合材料的介电测试结果显示，加入适量的OMPS能明显降低BT树脂的介电常数。

The curing behavior of octa (maleimidophenyl) silsesquioxane (OMPS)/BT composites

Octa(maleimidophenyl)silsesquioxane (OMPS) has been synthesized and characterized, and the bismaleimide-triazine (BT) resin composed of 4,4′-bismaleimidodiphenylmethane (BMI) and 2,2′-bis-(4-cyanatophenyl)propane (BCE) has been prepared. The results of DSC and FT-IR measurements showed that the curing reaction of an OMPS/BT composite was complete at 220℃. Curing of the OMPS/BT resins in the temperature range 140-220℃ was followed by dynamic mechanical analysis (DMA), and the results demonstrated the values of T_g were not as high as previously reported, suggesting that the curing process was not complete. Therefore the resins were treated by post-curing at 250℃ for 1h, after which their T_g values were significantly increased. The dielectric constants of OMPS/BT composites were markedly reduced by the incorporation of appropriate amounts of OMPS, while excess OMPS had a disadvantageous effect on dielectric constant as a result of its aggregation. 