| L12378圆形射流冲击和浸没冷却传热 |
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| 引用本文： | 周定伟,马重芳,刘登瀛. L12378圆形射流冲击和浸没冷却传热[J]. 西安交通大学学报, 2001, 35(9): 958-961 |
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| 作者姓名： | 周定伟 马重芳 刘登瀛 |
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| 作者单位： | 1. 北京工业大学环境与能源工程学院,
2. 中国科学院工程热物理研究所 |
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| 基金项目： | 国家自然科不基金资助项目（59976002）；国家重点基础研究发展规划资助项目（G2000026300） |
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| 摘 要： | 以最新微电子设备冷却剂L12378为工质，首次试验研究了用圆形自由射流冲击模式电子芯片的局部对流换热的情况，测定了驻点换热系数的径向分布，发现驻点换热随射流Re数和热流密度的增加及喷嘴直么和喷距的减小而增强，自然对流数据表明小尺寸换热率比预算值高出3倍，严格按照沸腾传热试验程序得到了过冷度为24K时的池沸腾传热曲线。
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| 关 键 词： | 射流冲击 模拟电子芯片 传热 微电子设备冷却剂 L12378 驻点换热 |
| 文章编号： | 0253－987X（2001）09-0958-04 |
Heat Transfer by Impingement Circular Jet and Immersion Cooling of L12378 |
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| Zhou Dingwei ,Ma Chongfang ,Liu Dengying. Heat Transfer by Impingement Circular Jet and Immersion Cooling of L12378[J]. Journal of Xi'an Jiaotong University, 2001, 35(9): 958-961 |
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| Authors: | Zhou Dingwei Ma Chongfang Liu Dengying |
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| Affiliation: | Zhou Dingwei 1,Ma Chongfang 1,Liu Dengying 2 |
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| Abstract: | Experimental study was performed to investigate the local heat transfer characteristics from a simulated microelectronic chip with impingement circular free surface jet, using dielectric liquid (L12378) as working fluid. Heat transfer coefficients of the stagnation point and lateral location were determined. The results revealed that stagnation heat transfer coefficient became larger with the increasing of Re number and heat flux and with the decreasing of nozzle diameter and nozzle to plate spacings. It was shown that the natural convection data for chip size heaters were as high as four times of the predicted values. According to rigorous procedures, pool boiling heat transfer curve under subcooling of 24 K was obtained. |
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| Keywords: | jet impingement simulated microelectronic chip heat transfer |
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