UV-LIGA与微细电火花加工组合制造微细电解阵列电极

采用UV-LIGA与微细电火花加工组合技术制造大长径比微细阵列电极.先通过UV-LI-GA技术制作微细群孔工具电极,然后通过电火花套料加工制作大长径比微细阵列电极.选取优化的工艺参数:前烘110℃保持12h;三步后烘50℃保持5min、70℃保持10min、90℃保持30min;采用谐振式电火花电源,电压200V、峰值电流1.5A、脉宽3.2μs、脉间6.4μs、放电间隙12μm等,制备了直径85μm、长1.5mm,长径比达17.65的微细阵列电极.最后用制作出的微细阵列电极作为工具电极进行微细电解加工实验,在120μm厚不锈钢板上电解加工出直径150μm、形状均匀的微细阵列群孔结构.实验证明:UV-LIGA与微细电加工组合制造技术是一种可行的制作高深宽比微结构的方法;利用微细阵列电极进行电解加工,能实现高效和高精度加工.

Fabrication of micro-ECM electrode array by combining UV-LIGA with micro electro-discharge machining

The combination of UV-LIGA (ultraviolet lithographie galvanoformung and abformung) with the micro electro-discharge machining (micro-EDM) process was adopted to fabricate high-as-pect-ratio electrode array. First, micro hole array was fabricated through the UV-LIGA technology, then the electrode array was fabricated by the micro-EDM. Using the optimized parameters: soft bake at 110℃ for 12 h; post bake at 50℃ for 5 min, 70℃ for 10 min and 90℃ for 30 min; reso-nant EDM power supply of 200 V voltage, 1.5 A peak current, 3.2 μs pulse width, 6. 4μs inter-pulse, and 12 μm discharge gap et al, the electrode array of diameter 85 μm and 1.5 mm long was fabricated, the aspect ratio being up to 17.65. Finally, the electrode array was employed as a tool in the micro-ECM (micro-electrodemical machining), and the micro hole array of diameter 150 μm was machined on a 120 μm thick stainless steel by the micro-ECM. The experimental results show that the technology of combining UV-LIGA with micro-EDM is a feasible method to fabricate high aspect-ratio micro-structures, and using the electrode array as a tool, the micro-electrodemical ma-chining can be carried out with high-efficiency and high-precision.