| 细晶压电涂层/基底界面裂纹热流强度因子分析 |
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| 引用本文： | 胡帅帅,刘建生,李俊林,魏含玉.细晶压电涂层/基底界面裂纹热流强度因子分析[J].科学技术与工程,2021,21(16):6582-6586. |
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| 作者姓名： | 胡帅帅 刘建生 李俊林 魏含玉 |
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| 作者单位： | 太原科技大学材料科学与工程学院, 太原030024;周口师范学院数学与统计学院,周口466000;太原科技大学材料科学与工程学院, 太原030024;太原科技大学应用科学学院, 太原030024;周口师范学院数学与统计学院,周口466000 |
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| 基金项目： | 国家自然科学基金面上项目(11972019)；河南省自然科学基金资助项目(202300410524)；河南省科技攻关项目(212102310397) |
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| 摘 要： | 研究了在热载荷作用下的细晶粒压电涂层/基底界面裂纹的力学行为,利用积分变换方法把热力学问题转变成了求解奇异积分方程,得出了问题的温度场及热流强度因子.最后,通过数值算例给出了热流强度因子同裂纹尺寸和涂层厚度之间的关系.结果表明:在热载荷的作用下涂层厚度较小时容易造成裂纹的扩展,可以通过增加涂层厚度来增强结构的安全性.
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| 关 键 词： | 细晶粒压电涂层 界面裂纹 热载荷 热流强度因子 |
| 收稿时间： | 2020/9/8 0:00:00 |
| 修稿时间： | 2021/3/11 0:00:00 |
Analysis of Heat Flux Intensity Factor for Interface Crack of Fine-grained Piezoelectric Coating/Substrate |
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| Hu Shuaishuai,Liu Jiansheng,Li Junlini,Wei Hanyu.Analysis of Heat Flux Intensity Factor for Interface Crack of Fine-grained Piezoelectric Coating/Substrate[J].Science Technology and Engineering,2021,21(16):6582-6586. |
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| Authors: | Hu Shuaishuai Liu Jiansheng Li Junlini Wei Hanyu |
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| Institution: | Zhoukou Normal University;School of Materials science and Engineering,Taiyuan University of Science and Technology |
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| Abstract: | The mechanical behavior of the interface crack of fine-grained piezoelectric coating/substrate under thermal loading is investigated. By using integral transformation method, the thermodynamic problem was transformed into solving singular integral equation, and the temperature field and heat flux intensity factor of the problem were obtained. Finally, the relationship between thermal intensity factor and crack size and coating thickness are given by numerical examples.The results show that when the coating thickness is small under the action of thermal load, it is easy to cause crack propagation, and the safety of the structure can be enhanced by increasing the coating thickness. |
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| Keywords: | Fine-grained piezoelectric coating Interface crack Thermal loading Thermal intensity factor |
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