多元件电路板空间热状态的数值模拟

电子系统的热扩散性是限制电路小型化的主要因素之一，有效地冷却电子元件对维护电路的正常工作和提高可靠性起着决定性作用。利用有限容积法对五个元件水平放置的电路板组成的矩形封闭空间的流场及温度分布进行了数值模拟，结果表明，电子元件的安装位置对空间的温度分布有很大的影响。传统的等间距安装元件不是最佳方案，非等间距安装可有效降低元件的热负荷。

Numerical Simulation of Thermal State in the Environment of Circuit Board of MIilti Components

Heat dissipation capability of an electronic system has become one of primary limiting factors for circuit miniaturization Effective cooling of electronic components is crucial in maintaining the circuit normal operation and enhancing reliability Numerical simulation is performed for flow field and temperature distribution of rectangular enclosure in which there is a five chips horizontal substrate on the bottom by using finite volume approach The result shows that the position of the arrangement of electronic component affects strongly the temperature distribution of the environment around circuit board The conventional equispaced arrangement is not an optimum option Non-equi-spaced arrangement can reduce effectively the thermal load of electronic component An optimum arrangement position should be selected when designing circuit board