高硅铝合金材料高温充氧氧化工艺

针对应用广泛的高硅铝合金电子封装材料,采用高温充氧氧化工艺,对已挤压成形的Al-30Si及Al-40Si高硅铝合金材料进行后续处理,通过扫描电镜、金相显微镜、热物性测试仪及电子万能拉伸试验机等,对材料显微组织、密度、气密性、热膨胀系数、热导率及抗压强度进行了分析比较。研究结果表明:高温充氧氧化后材料晶粒长大,Si含量高的材料长大更为明显,并存在Si颗粒偏聚现象;高温氧化后材料致密度增加,气密性提高;氧化后Al-30Si材料热膨胀系数略有增加,而充氧氧化对Al-40Si材料的热膨胀系数的影响不明显,但可提高材料热导率,Al-30Si与Al-40Si材料热导率分别提高16.4%和23.5%;高温氧化工艺显著降低材料抗压强度,Al-30Si与Al-40Si材料经氧化后抗压强度分别下降26.8%和20.5%。

Oxidating processes in high temperature oxygenation of high-silicon aluminum alloy

In order to fabricate high-silicon aluminum alloy electronic packaging materials, the oxidating processes in high temperature oxygenation was applied to the Al-30Si and Al-40Si high-silicon aluminum alloys which were prepared through extrusion process. Scanning electron microscope, optical microscopy, thermal physical tester and universal material testing machine were used to study the microstructure, density, hermeticity, coefficient of thermal expansion, thermal conductivity and compressive strength. The experimental results indicate that when Al-Si alloy material is oxidated in high temperature oxygenation, the size of the silicon particles increases especially the silicon crystal of Al-40Si aggregates and grows more obviously, and the density and the hermeticity are improved, The thermal expansion coefficient of AI-30Si increases slightly, but the oxidation technology has little influence on that of Al-40Si. However, the oxidation technology has remarkable favorable influence on the thermal conductivity and the compression strength. The thermal conductivity of AI-30Si and Al-40Si respectively increases by 16.4% and 23.5%, and the compression strength of Al-30Si and Al-40Si decreases by 26.8% and 20.5%, respectively.