电子散斑和全息光弹混合方法测量透明材料的应力强度因子

全息光弹性中等和线是获得断裂力学中应力强度因子的一种有效方法，但用传统的全息光弹性方法获取等和线需暗室，要经过显影定影及再现，而且不能直接数字化使其应用受到限制，提出一种将全息光弹性与相移电子散斑干涉有机结合的方法，不但克服传统全息光弹性的不足，而且使全息光弹性实现了数字化，中将这一方法成功应用于有预制裂纹的三点弯曲试件上，定量求得其应力强度因子K1，实验值和理论值具有相一致的结果。

Measurement of SIF of transparent material by using a technique integrated phase-shift ESPI method with holography photoelastic method

Analysing isochromatic fringe patterns of holography photoelasticity is a good way to obtain stress intensity factor (SIF). The application of traditional holography photoelastic method is confined because the process of getting patterns is complex and needs professional skills and the patterns cannot be digitalized. This paper gives a new method which integrates phase-shift electric speckle pattern interferometry (ESPI) method with holography photoelastic method. It not only overcomes the shortcomings of traditional holography photoelastic method, but also digitalizes holography photoelasticity. Using this method can measure SIF of a three-point bending specimen with prefabricated crack. The theoretic results accord with experimental results.