| Sn-Bi系低温无Pb焊料的研究现状及发展趋势 |
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| 引用本文： | 陈剑明,张建波,李明茂.Sn-Bi系低温无Pb焊料的研究现状及发展趋势[J].上海理工大学学报,2017,38(2):112-118. |
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| 作者姓名： | 陈剑明 张建波 李明茂 |
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| 作者单位： | 江西理工大学 材料科学与工程学院, 江西 赣州 341000,江西理工大学 工程研究院, 江西 赣州 341000,江西理工大学 工程研究院, 江西 赣州 341000 |
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| 基金项目： | 江西省科技自然科学基金项目（20142BAB206013） |
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| 摘 要： | 低熔点Sn-Bi焊料是比较有发展潜力的低温无Pb焊料.根据Sn-Bi焊料的特性及其应用存在的问题，结合近几年国内外对Sn-Bi系低温无Pb焊料的最新研究成果，综述了Sn-Bi无Pb焊料的温度诱导熔体结构转变现象及其对Sn-Bi焊料凝固组织的影响，介绍了合金元素及稀土元素的添加对Sn-Bi焊料润湿性能的影响及其影响机制，并分类总结了不同元素对Sn-Bi焊料与Cu基体界面化合物生长的促进与抑制作用及其原理，最后综合评述Sn-Bi低温无Pb焊料存在的问题，对Sn-Bi焊料的发展趋势进行了展望.
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| 关 键 词： | Sn-Bi焊料 无Pb焊料 结构转变 润湿性能 界面化合物 |
| 收稿时间： | 2016/11/28 0:00:00 |
Review of Sn-Bi Low Temperature Lead-free Solder |
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| CHEN Jianming,ZHANG Jianbo and LI Mingmao.Review of Sn-Bi Low Temperature Lead-free Solder[J].Journal of University of Shanghai For Science and Technology,2017,38(2):112-118. |
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| Authors: | CHEN Jianming ZHANG Jianbo and LI Mingmao |
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| Institution: | School of Material Science and Engineering, Jiangxi University of Science and Techonology, Ganzhou 341000, China,Institute of Engineering and Research, Jiangxi University of Science and Techonology, Ganzhou 341000, China and Institute of Engineering and Research, Jiangxi University of Science and Techonology, Ganzhou 341000, China |
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| Abstract: | With low melting point,Sn-Bi solder has a prospective application as low temperature lead-free solder.This paper reviews the phenomenon of the temperature induced melting structure transition in Sn-Bi lead-free solder and its effect on solidified microstructure of Sn-Bi solder.This work is based on the characteristics and issues in application of Sn-Bi solder,combing with recent research in Sn-Bi low-temperature solder field at home and abroad.Firstly,the effect of alloy element and rare earth element on wetting property of Sn-Bi solder and the related mechanism were introduced.Secondly,the enhancement or degradation of interfacial compounds growth of Sn-Bi solder and Cu substrate by using different element were classified and summarized.Finally,we comprehensively analyzed the existing challenge on Sn-Bi low temperature lead-free solder and also outlooked the prospect of development trend in Sn-Bi solder. |
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| Keywords: | Sn-Bi solder lead-free solder structure transition wetting properties interfacial compounds |
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