Joint Strength with Soldering of Al2O3 Ceramics After Ni-P Chemical Plating

Ni-P alloy was chemically plated on Al2O3 ceramics to produce uniform alloy coatings at temperatures below 70~C. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170℃ for 15 min. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.     

原位生成法半固态连接Si3N4复相陶瓷的接头组织

为探索陶瓷材料的有效连接途径,提出一种原位生成增强颗粒的半固态钎焊陶瓷材料方法。采用自制钎料对Si3N4复相陶瓷进行钎焊试验。采取分步焊接的方法,在1023K下使钎缝内生成一定数量的AlCu2Ti金属间化合物,然后在1173K下对陶瓷材料进行半固态连接。显微观察表明:钎缝组织由低熔点的钎料基体和高熔点的金属间化合物组成,金属间化合物均匀分布在钎料基体中,有利于改善接头性能,降低接头的热膨胀不均匀性。     

含金属间化合物的Al基合金半固态加压连接Si3N4陶瓷

用含金属间化合物Al3Ti或Al3Zr的Al基合金作连接材料,研究了半固态加压连接Si3N4陶瓷时接头的形成,以及Al基合金种类和连接压力对接头组织与强度的影响。结果表明:半固态连接可获得性能良好的陶瓷接头;连接过程中加压能提高连接层金属中耐高温金属间化合物的含量,达到提高接头高温性能的目的;连接压力适当时,接头在室温和600℃下的剪切强度可分别达到126～136MPa和32～34MPa,明显比用纯Al连接的接头强度高;在结合界面形成过程中,第二活性元素Ti和Zr也参与了界面反应。     

Solid-Liquid State Bonding of Si3N4 Ceramics with Ceramic-Modified Brazing Alloy

Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are generally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and compact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reaction between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume fraction in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5% TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes fractions above 20%, the joint strengths decrease.     

高纯氧化铝与金属铌的活性钎焊

为了确定高纯氧化铝陶瓷与金属Nb的直接钎焊工艺参数,采用AgCuTi活性钎料,研究了钎焊温度和钎料中的钛含量对接头组成、界面反应以及接头剪切强度的影响。钎焊温度在825~900℃范围变化时,对接头强度的影响不明显,但温度超过900℃强度降低。钎料中钛的质量分数为1%和2%时,接头的强度基本相同;含量为3%时,剪切强度明显降低。当钛的质量分数为2%,钎焊温度为850℃,保温时间为20 min时,接头剪切强度接近100MPa。接头陶瓷一侧界面反应产物主要为Cu3Ti3O和Ti的氧化物,较高温度时反应层中生成的过多Ti2O可能是导致接头强度显著降低的一个重要因素。     

YBCO超导块材超导性能高温失超及恢复

研究了经过高温热处理而失去超导电性的YBCO(Y-Ba-Cu-O)超导块材经过后氧化热处理恢复其超导性能的可行性,为YBCO超导块材的连接奠定基础。对原始YBCO块材、热处理后YBCO块材及后氧化热处理YBCO(块材和粉末)的超导性能、微观组织及物相变化进行了分析。结果表明:采用常规顶部籽晶熔融织构生长法制备的YBCO块材经过高温热处理后会完全失去超导性;经过后氧化热处理后,其超导性能得到恢复。高温热处理并未改变块材的织构特征,而其晶体结构由正交结构转变成四方结构,从而失去超导性能;经过后氧化热处理,其晶体结构又由四方结构转变为正交结构,完全恢复了超导性能。     

高铌含量Ti3Al基合金的扩散连接

为获得高强度的Ti3Al基合金接头,采用热-力学模拟试验机Gleeble 1500D进行了Ti-23Al-17Nb合金的高真空扩散连接的研究。结果表明,增大连接压力、提高连接温度以及延长保温时间能促进接头界面的焊合,但也会导致接头变形加大和基体相B2的粗化。优化的连接温度、连接压力和保温时间分别为980℃、7 MPa和30 min,其接头室温和650℃拉伸强度为921 MPa和639 MPa,分别达到了原始母材对应温度下的强度的95%和91%。低连接参数下的接头断裂发生于结合界面,而高连接参数下的接头断裂发生于远离结合界面的母材中,其断裂方式属于准解理断裂。     

Bending Properties and Fracture Behavior of Ti-23Al-17Nb Alloy Laser Beam Welding Joints

Ti-23Al-17Nb alloy is an important high temperature structural material used in the space and aerospace fields. Welding of this alloy is an indispensable processing method, so the microstructures and mechanical properties of these welded joints must be studied to improve the welds. Longitudinal three-point bending tests were conducted to measure the bending ductility of laser beam welded joints. The crack distribution and fracture surface were investigated to further analyze the fracture behavior. The resul...