发汗控制方程差分解法的并行化

本文给出固定边界发汗控制方程显式与隐式差分解法的并行化方法.数值试验表明隐式差分格式的数值稳定性的条件比显式差分格式的条件要宽松得多,这与理论分析的结果是一致的;数值试验还表明显式方法的加速比及效率均高于隐式方法,但隐式方法的时间步长可以放大,从整体上更节省CPU时间.本文给出固定边界发汗控制方程显式与隐式差分解法的并行化方法.数值试验表明隐式差分格式的数值稳定性的条件比显式差分格式的条件要宽松得多,这与理论分析的结果是一致的;数值试验还表明显式方法的加速比及效率均高于隐式方法,但隐式方法的时间步长可以放大,从整体上更节省CPU时间.     

高速SDLC协议通信控制器的专用集成电路(ASIC)设计

本文分析了采用系统集成思想设计的SDLC协议通信控制器的工作原理及系统要求,在自顶向下的设计原则下,提出了该通信控制器ASIC的设计原理,阐明了该ASIC在系统应用中的巨大优越性.     

带有参数的数据包络分析C~2R模型

本文为了改进C~2R模型反映决策单元相对信息不完全的不足,提出了参数型数据包络分析模型,讨论了这个模型的有关性质,给出了阔值和有效值的概念.经过理论分析和实例验证,这两个值可更好地反映决策单元的相对信息.     

基于信号重构的一种系统仿真方法

本文根据信号重构的思想，提出了一种系统仿真方法。该方法是对时域矩阵仿真方法的扩展，即保留了时域矩阵方法快速性的特点，又提高了仿真精度。文中还对该方法的截断误差做出了估计，并证明了该方法的收敛性。最后，通过仿真例子说明了该方法的有效性。     

石油化工过程中控制与联锁自保系统的仿真

本文介绍了石油化工过程中控制与联锁自保系统的仿真模型的建立方法，并附以相应程序。     

控制系统仿真的新问题：模型不确定性

本文从解决模型不确定性的角度研究了控制系统仿真问题。首先，讨论了把模型不确定性引入控制系统仿真的必要性，然后阐述了一种全新的观点：控制系统仿真应该是鲁棒辨识与鲁棒控制的有机结合     

Understanding of the influence of process parameters on the heat transfer behavior at the metal/die interface in high pressure die casting process

The current paper focuses on the influence of the process parameters on the peak values of the interfacial heat transfer coefficient(IHTC)at metal/die interface during high pressure die casting(HPDC)process.A"step shape"casting and AM50 alloy were used during the experiment.The IHTC was determined by solving the inverse thermal problem based on the measured temperature inside the die.Results show that the initial die surface temperature(IDST,TDI)has a dominant influence while the casting pressure and fast shot velocity have a secondary influence on the IHTC peak values.By curve fitting,it was found that the IHTC peak value(hmax)changes as a function of the IDST in a manner of hmax=e αTγ DI .Such relationship between the IHTC peak value and the IDST can also be found when the casting alloy is ADC12,indicating that this phenomenon is a common characteristic in the HPDC process.     

Net-shape forming of composite packages with high thermal conductivity

The continuing miniaturization of electronic devices in microelectronics and semiconductors drives the development of new packaging materials with enhanced thermal conductivity to dissipate the heat generated in electronic packages.In recent years,several promising composite materials with high thermal conductivity have been developed successfully for high performance electronic equipment to replace the traditional Kovar and Cu/W or Cu/Mo alloys,such as SiCp/Al,SICp/Cu,diamond/Al and diamond/Cu.However,thes...     

Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint

Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints.In this current research,Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder,and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size.A quantitative formula was se...     

Light emission of double-walled carbon nanotube filaments doped with yttrium and europium

As the potential applications of carbon nanotubes in the field of electroluminescence,elements yttrium and europium were introduced to modify the emission properties of double-walled carbon nanotubes(DWNTs)to obtain higher efficacy and other properties.The light emission spectrum of the Y-Eu-doped DWNT filament is suppressed in the near-infrared range,while enhanced in the mid-infrared range.The doped DWNT filament can reach higher efficacy than that of the pure DWNT filament at the same input power and can...