Discovery of submicron diamonds within kimberlite in Liaoning Province, China and its significance

Conclusions Although the natural microdiamonds in the non-kimberlite have been well studied by Sobolev, the discovery of submicron diamonds in the kimberlite and not in the form of inclusion is still the first time in the world. Different from the common growth of the kimberlite e-clogite/peridotite with the diamond, the submicron diamonds grow together with the very thin dispersive materials with platina and blende structures. The growth process of the thin lath-shaped diamond crystals from the aggregative parent materials is observed. The densities of the aggregative parent materials are different from place to place within the microspace. The submicron diamonds and their parasitized diamonds formed in different generations.     

添加剂对高铋电解铜体系中铜沉积过程的影响

用稳态法研究了添加剂Ｃｌ－、ｇｌｕｅ、（ＮＨ２）２ＣＳ对高铋电解铜体系阴极铜沉积反应的影响。用ＡＡ、ＳＥＭ、ＸＲＤ等仪器研究了添加剂对阴极铜沉积的组成和晶面取向的影响。结果表明：Ｃｌ－对铜沉积反应起去极化作用。ｇｌｕｅ对铜沉积反应起强极化作用。（ＮＨ２）２ＣＳ能改变铜沉积过程的电化学反应机理,使铜沉积反应出现由扩散控制的极限电流。当Ｃｌ－、ｇｌｕｅ、（ＮＨ２）２ＣＳ共存于电解液中时,既对铜沉积反应起强极化作用,又使铜沉积过程的极限电流降低。以低电流密度（２００Ａ·ｍ－２）电解,添加剂存在时可使阴极铜沉积中铋含量从０．０１３％降至０．００２１％,但添加剂不影响铜沉积的晶面择优取向（２２０）。以高电流密度（１５００Ａ·ｍ－２）电解时,添加剂的存在,会改变铜沉积的晶面择优取向。     

铋对铜电解精炼中阴极铜沉积过程的影响

文章采用循环伏安法研究了铋离子Ｂｉ３＋存在于酸性硫酸铜电解液中时，对铜电解精炼中阴极铜沉积反应的峰电流ｉｐ、峰电势ｐ的影响，并根据循环伏安曲线的形状判断铜沉积反应的可逆性。结果表明：铜沉积反应是不可逆的。Ｂｉ３＋离子存在于电解液中时不改变铜沉积反应的机理，但却使铜沉积反应的峰电流ｉｐ值降低，峰电势ｐ值向正方向移动．文章还从电化学和热力学角度分析了Ｂｉ３＋存在于电解液中时，对阴极铜电极平衡电势的影响。     

梯度复合阴极LaBaCo_2O_(5+δ)-Ce_(0.8)Sm_(0.2)O_(1.9)的制备及电化学性能

采用机械混合法制备中温固体氧化物燃料电池梯度复合阴极材料LaBaCo2O5+δ-Ce0.8Sm0.2O1.9(LBCO-SDC)。通过X线衍射(XRD)分析、扫描电镜(SEM)分析、热膨胀法、交流阻抗谱法和循环伏安法分别对晶体结构、界面微观结构、热膨胀性及电化学性能进行表征。结果表明:LBCO阴极与SDC电解质之间具有良好的化学相容性;电解质SDC的添加有效地降低了阴极材料LBCO的热膨胀系数;双层梯度复合阴极比单层阴极表现出更小的比表面电阻以及极化过电位,显示出更好的电化学性能;在700℃时,双层梯度复合阴极的比表面电阻与LBCO阴极相比下降了约13.2%,极化过电位(电流密度为0.20 A/cm2)从51.0 mV下降到46.4 mV。     

纳米碳化硅-镍复合电镀的研究

采用复合电镀技术在铜基上制备了高硬度、高耐磨的Ni-SiC纳米镀层。研究了阴极电流密度、镀液pH、温度以及搅拌速度对复合沉积层的显微硬度和共沉积速率的影响,同时优化了各工艺参数,并对Ni-SiC纳米复合镀层进行了表面形貌和能谱分析。实验结果表明,Ni-SiC纳米复合电镀层表面平整光滑,显微组织均匀、致密,其显微硬度也较纯镍镀层有显著提高。     

青蒿素及其衍生物的电化学性质研究 Ⅱ氯化血红素存在下的青蒿素还原机理

用电化学方法研究了青蒿素与氯化血红素之间的相互作用。青蒿素在玻璃碳电极上于-1.08V处能发生一个2电子转移的不可逆还原。即使在低至4.0×10^-8mol/L氯化血红素存在下,青蒿素仍可被催化还原,阴极过电位降低了600mV。配合物EDTA-Fe(Ⅲ)具有类似氯化血红素的催化性质,它降低了QHS阴极过电位590mV。在这个体系中,青蒿素在碳电极上的还原是一个借助于氯化血红素催化的还原过程,氯化血红素的存在降低了青蒿素还原活化能,促进了青蒿素的分解。文中讨论了该反应的还原机理。     

铜表面镍-石墨烯的电沉积制备及耐腐蚀性能

采用电沉积方法,将石墨烯与镍离子共沉积到被保护的铜基底上,制备了镍-石墨烯复合镀层.通过X射线衍射(XRD)、扫面电子显微镜(SEM)等方法对复合材料的物质结构、表面形貌特征进行了表征,采用海水浸泡方法研究了复合材料的抗腐蚀性能.结果表明:当电流密度为5 A/dm2时,共沉积方法制备的镍-石墨烯复合镀层平整连续,晶粒较小,石墨烯穿插于多个镍颗粒之间,将镍颗粒包裹于其中,能有效阻断海水中的酸根、碱性离子对铜基底的腐蚀作用,明显增强了复合材料的耐腐蚀性.此研究对船舶及海洋工程金属构件的抗海水腐蚀方法具有一定的参考价值.     

碳钢在我国四种土壤中腐蚀机理的研究

利用Q235钢在我国四种典型土壤（即大庆中心站苏打盐土、大港中心站滨海盐渍土、新疆中心站沙漠戈壁土、华南站酸性土）中进行室内模拟加速腐蚀试验和电化学实验，并对腐蚀试验后的腐蚀产物进行了微观分析和微生物分析。研究结果表明，碳钢在上述四种土壤中的腐蚀过程为：阳极过程为铁的溶解，非晶态羟基氧化铁的生成，经生化最终成为褐铁矿；阴极过程为氧去极化为主要的扩散控制过程。华南土pH值较低，同时伴随着氢去极化腐蚀的阴极过程。大港土中检测出少量的FeS，这是由于SRB参与氢去极化过程的结果。腐蚀过程受阴极极化控制，扩散控制程度随试验土样温度的升高和含水量的增大而增大。     

熔盐电镀—Ⅱ,钼的电化学成核和长大及其对电镀的影响

本文主要用恒电势法研究了钼晶核的形成和长大的动力学规律及其对电镀的影响。实验证明,在所选盐系、温度及浓度范围内,阴极反应开始阶段的控制步骤是半球形晶核的形成及其在扩散控制下的长大。适当控制影响这一步骤的因素,可以改善镀层质量。增大超电势将使晶核密度迅速增大,有利于获得结晶细致、光滑致密的镀层。在恒电势下,升高温度将使晶核密度增大,对改善镀层有利;而在恒电流下,升高温度则极化减小,晶核密度变小,对电镀不利。无论在恒电势或恒电流下,增大浓度都会使晶核密度变小,晶粒变粗,对电镀不利。     

半固态铸造-叠轧深变形制备超细晶A2017合金

利用波浪型倾斜板半固态铸造和叠轧深变形的复合成形模式在等效应变为4.0的条件下制备出了平均晶粒为0.5μm的A2017合金超细晶材料.随着叠轧道次的增加,合金的维氏硬度先增后降,随后缓慢增加.在一定的退火温度下合金组织由亚稳定态向稳定态转变,在200℃保温1 h,晶粒生长比较缓慢,在退火温度高于200℃时晶粒变化明显;随着退火温度的升高,合金组织发生回复与再结晶过程,合金加工硬化逐渐消失,合金的维氏硬度降低.     

A TiCx reinforced Fe (Al) matrix composite using in-situ reaction

A new Fe matrix composite reinforced by the in-situ generated TiCx grains was prepared using the element Fe and Ti3AlC2 powders as the starting materials.Several hot-pressing temperatures were tried for exploring the phase transformation behavior from Ti3AlC2 to TiC x.Microstructures of the hot-pressed product were observed and analyzed.A tensile test was carried out for the new composite material,and the fracture face was analyzed.The results showed that the starting Ti3AlC2 was wholly decomposed and transformed into submicron TiC x grains at the hotpressing temperature above 1100℃.Most of the Al ions escaped from Ti3AlC2 were aggregated at the grain boundary of Fe grains,but a small amount of Al ions could be absorbed by Fe and formed Fe(Al) alloy around the surface of Fe grains.The prepared material exhibited a higher tensile strength of about 660 MPa and a uniform deformation of about 7%.     

Mechanical properties of electroformed copper layers with gradient microstructure

The electroformed copper layer with gradient microstructure was prepared using the ultrasonic technique. The microstructure of the electroformed copper layer was observed by using an optical microscope (OM) and a scanning electron microscope (SEM). The preferred orientations of the layer were characterized by X-ray diffraction (XRD). The mechanical properties were evaluated with a Vicker’s hardness tester and a tensile tester. It is found the gradient microstructure consists of two main parts: the outer part (faraway substrate) with columnar crystals and the inner part (nearby substrate) with equiaxed grains. The Cu-(220) preferred orientation increases with the increasing thickness of the copper layer. The test results show that the microhardness of the electroformed copper layer decreases with increasing grain size along the growth direction and presents a gradient distribution. The tensile strength of the outer part of the electroformed copper layer is higher than that of the inner part but at the cost of ductility. Meanwhile, the integral mechanical properties of the electroformed copper with gradient microstructure are significantly improved in comparison with the pure copper deposit.     

多孔镍阴极在碱性介质中释氢性能的研究

本文研究了用电镀法制备的各种多孔镍电极的镍锌含量、lg|i|、电极表面积及其在碱性介质中释氢过电位之间的关系。实验结果表明,用电镀法制得的多孔镍电极释氢过电位明显降低(>200mV),塔菲尔参数a、b值约为平滑镍电极的1/2,电极表面涂层是分散均匀的多晶微粒。     

镍包覆铜复合粉末烧结体界面扩散行为研究

利用固相烧结法将镍包铜粉成功地制成了块状烧结体,通过SEM、XRD和EDS研究了烧结过程中镍包铜粉中界面的迁移情况.结果表明,随烧结温度升高,颗粒内原子扩散系数越大,烧结体界面迁移越容易,形成较大的晶粒,同时界面组织也比较均匀.在扩散过程中,由于镍的扩散系数比铜大,镍层扩散进入铜形成了铜镍固溶体,界面呈现单向迁移.     

纳米复合Ti(C,N)基陶瓷烧结晶粒长大的特性

利用材料热力学原理，推导出纳米复合Ti(C，N)基金属陶瓷烧结过程中，晶粒生长速度与大、小颗粒半径之间的关系，并结合实验结果进行了分析．结果表明：纳米复合金属陶瓷在烧结的开始阶段，大晶粒的长大速度呈加速趋势，当大晶粒长大到一定程度时，其长大速度达到最大值，随后，速度逐渐减慢．采用放电等离子烧结、脉冲烧结等方法有可能进一步减小小颗粒的半径．Mo、WC、TiN的加入，抑制了沉淀—析出过程的进行，对晶粒的长大有一定的抑制作用．     

镍电解阳极液直接电解净化除铜研究

本文探讨了镍电解阳极液直接进行电解净化除铜处理过程。镍电解阳极液中的ＣＵ２＋离子优先于Ｎｉ２＋离子在镍电极和铜电极上放电还原，其电极过程具有溶液扩散传质步骤控制的动力学规律。在阴极电位不低于－０．５００Ｖ（ｖｓ．ＳＣＥ．）和溶液搅拌条件下，采用多孔镍作阴极在常温下就能使镍电解阳极液的ＣＵ２＋离子浓度降至０．００２ｇ／Ｌ以下，达到深度净化除铜要求。加强溶液搅拌和增大电极面积有利于加快电解净化除铜速度，电解净化除钢产物为９９％以上的金属铜粉。     

硫代氨基脲对铜阳极溶出和阴极沉积过程影响的CV和EQCM研究

Cu的阳极溶出和阴极沉积是镀铜、铜电解和有机电合成等领域中一个重要的过程.本文运用电化学循环伏安(CV)和石英晶体微天平(EQCM)方法研究了酸性介质中硫代氨基脲(HT)对铜阳极溶出和阴极沉积过程的影响.结果表明:在含HT的溶液中,铜阳极溶出和阴极沉积过程的M/n分别为33.0和31.6g/mol,是一个2-电子过程.实验条件下,HT能吸附在铜电极表面,阻化了铜的电极过程,但并不改变铜电极阳极溶出和阴极沉积的历程.本文从电极表面质量定量变化的角度提供了Cu阳极溶出和阴极沉积过程的新数据.     

Orientation variation along growth direction of millimeter free-standing CVD diamond thinned by mechanical grinding

A free-standing diamond film with millimeter thickness prepared by DC arc plasma jet was thinned successively by mechanical grinding. The orientation and quality of the diamond films with different thicknesses were characterized by X-ray diffraction and Raman spectroscopy, respectively. The results show a random grain-orientation distribution during the initial growth stage. As the film thickness increases, the preferred orientation of the diamond film changes from (111) to (220), due to the competitive growth mechanism. Twinning generated during the nucleation stage appears to stabilize the preferential growth along the 〈110〉 direction. The interplanar spacing of the (220) plane is enlarged as the film thickness increases, which is caused by the increase of non-diamond-phase carbon and impurities under the cyclic gas. In addition, the quality of the diamond film is barely degraded during the growth process. Furthermore, the peak shift demonstrates a significant inhomogeneity of stress along the film growth direction, which results from competitive growth.     

稀土元素对含铬白口铸铁中共晶碳化物生长的影响

文中研制了一套高温度梯度的区域熔化定向凝固装置,能在工业用共晶成份的含铬白口铸铁试样中,得到平整的液—固界面;并由于在液态保持的时间较短,故可保留稀土变质处理的效果.使用这种装置研究了低铬(4%Cr)白口铸铁和高铬(20%Cr)白口铸铁中共晶碳化物的生长,以及稀土元素的存在对其造成的影响.在低铬白口铸铁中,随着稀土元素的加入,使共晶凝固时的领先相由基本上是碳化物变为基本上是奥氏体,并由于生长过程中,奥氏体在碳化物前端相互搭桥,使许多板状碳化物转变成板条状和杆状,稀土元素含量愈高,转变的份额愈多;高铬铸铁的共晶凝固与低铬铸铁不同,即使在不含稀土元素的情况下,亦主要是奥氏体为领先相,加入稀土元素对共晶生长时的领先相及碳化物的形貌没有明显的影响.     

In situ observation of austenite grain growth behavior in the simulated coarse-grained heat-affected zone of Ti-microalloyed steels

The austenite grain growth behavior in a simulated coarse-grained heat-affected zone during thermal cycling was investigated via in situ observation. Austenite grains nucleated at ferrite grain boundaries and then grew in different directions through movement of grain boundaries into the ferrite phase. Subsequently, the adjacent austenite grains impinged against each other during the α→γ transformation. After the α→γ transformation, austenite grains coarsened via the coalescence of small grains and via boundary migration between grains. The growth process of austenite grains was a continuous process during heating, isothermal holding, and cooling in simulated thermal cycling. Abundant finely dispersed nanoscale TiN particles in a steel specimen containing 0.012wt% Ti effectively retarded the grain boundary migration, which resulted in refined austenite grains. When the Ti concentration in the steel was increased, the number of TiN particles decreased and their size coarsened. The big particles were not effective in pinning the austenite grain boundary movement and resulted in coarse austenite grains.