Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration |
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| Authors: | Hui Chen Cheng-chang Jia Shang-jie Li |
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| Affiliation: | 1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China
2. Shenzhen Haimingrun Industrial Co., Ltd., Shenzhen, 518128, China
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| Abstract: | Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature (HPHT) infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters (temperature, pressure, and time). The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W/(m·K) were achieved at the optimal sintering parameters of 1200°C, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity. |
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