In order to research the effect of MEMS (micro-electromechanical systems) fabrication process based on one side etching on mode-localized accelerometer, effects of adhesion and footing on mode-localized accelerometer was investigated by analyzing the effect of release and etching on the device structure, amplitude-frequency characteristic and initial working point. The results show that when the oxide layer is released, the device layer is easily adhered to the substrate due to the presence of the liquid tension, thus, the device failure happens. And the mass mismatch of the weakly coupled resonators is induced by the footing phenomenon, then a large initial amplitude ratio drift is generated and it is difficult to measure the signal. It is concluded that uncertainty of mode-localized accelerometer is induced by the MEMS fabrication process based on one side etching.
参考文献
相似文献
引证文献
引用本文
康昊,苏健军,常洪龙. 粘附和根切对模态局部化加速度计的影响[J]. 科学技术与工程, 2021, 21(35): 15108-15113. Kang Hao, Su Jianjun, Chang Honglong. The Influence of Adhesion and Footing on Mode-localized Accelerometer[J]. Science Technology and Engineering,2021,21(35):15108-15113.